The Xindashida Zhongweixing FA4230 wafer-handling robot in the bonding process application of the semiconductor industry.
2025-07-25
The Xindashida Zhongweixing FA4230 wafer-handling robot in the bonding process application of the semiconductor industry.
Project Background
The emergence of horizontal multi-joint wafer-handling robots stems from the semiconductor manufacturing industry’s continuously escalating demands for high precision, high efficiency, and complex operations. Their design and technological development are primarily driven by the following factors:
1. Diversity of wafer box (FOUP) and equipment interfaces: The height and spacing of the load ports vary among different pieces of equipment.
2. Requirements for Multi-Process Coordination: Wafers need to be frequently transferred between equipment such as lithography, etching, cleaning, and inspection machines. A multi-joint structure can flexibly adapt to the varying interface positions and orientations of different pieces of equipment.
3. High-speed motion and low vibration: Multi-joint structures (such as SCARA robots) achieve high-speed motion through independent axis control, while optimizing the dynamic model to suppress vibrations and shorten wafer transfer time.
Customer needs
1. Vibrations generated during the horizontal movement of the wafer manipulator affect the wafers, reducing their yield rate.
2. The equipment layout has limited space, making it impossible to install a traveling axis. (Typically, a conventional single-joint wafer robot requires a traveling axis to meet the wafer-handling needs; however, the inclusion of a traveling axis significantly increases the overall size of the equipment.)
Xinshida Solution
Proposal Description
Employing a four-axis articulated design that combines linear and composite motions, this system achieves precise positioning of wafers in three-dimensional space during the wafer bonding process. Specifically, the J2/J3 axes work in coordinated control to manage the motion trajectory in the horizontal plane, while the J4 axis independently handles the orientation adjustment of the end effector, thereby meeting the stringent requirements for angular compensation during wafer transfer.
Scheme advantages
1. Utilizing servo motors and S-curve acceleration/deceleration control, this system achieves high-speed, high-precision handling that meets the tight-space requirements of semiconductor equipment (such as FOUP stockers).
2. Integrated Drive System: Equipped with the SC410 drive-and-control integrated platform, this system innovatively integrates motion control, servo drive, and I/O communication modules. It adopts a multi-core heterogeneous processor architecture to achieve a real-time control cycle of 1 ms, significantly enhancing the dynamic response performance of multi-axis coordinated motion.
3. Rigid Structural Optimization: The truss-type fuselage structure, optimized through finite element analysis and paired with aerospace-grade aluminum alloy materials, achieves a 40% increase in structural stiffness while reducing the overall weight by 25%. A triple-damping design effectively suppresses high-frequency vibrations, ensuring positioning stability under an acceleration of 10 m/s².
Scheme Composition
Xinshida Zhongweixing’s 4-axis atmospheric horizontal multi-joint single-arm FA4230 wafer robot, AC power supply, SC410 integrated drive and control unit, programming and debugging computer, and more.
Associated products
FA4230_4-Axis Atmospheric Horizontal Multi-Joint Single-Arm Wafer Handling Robot
Project Results
The Xindashida Zhongweixing FA4230 wafer robot arm adjusts its path through joint degrees of freedom, effectively avoiding collisions and reducing losses in customer production. It enables high-speed, high-precision handling and is adaptable to semiconductor equipment with various workstation layouts.
