The Xindashida Zhongweixing FA-series robots in the semiconductor industry for wafer handling applications.
2025-07-25
The Xindashida Zhongweixing FA-series robots in the semiconductor industry for wafer handling applications.
Project Background
In the rapid wave of modern technological advancement, semiconductors—being the core hardware foundation of the electronic information industry—have become ubiquitous, from smartphones and computers to automobiles and industrial automation equipment. They are not only a key driving force behind the information technology revolution but also an important indicator for measuring a country’s scientific and technological strength and economic level.
The semiconductor industry primarily consists of three major segments: design, manufacturing, and packaging, with the manufacturing segment playing a particularly critical role. In the semiconductor manufacturing process, wafers undergo a series of complex and highly precise steps—including photolithography, etching, and ion implantation—to create various electronic components such as transistors, capacitors, and resistors, which are then interconnected to form complete circuits. Between these processes, the handling and transportation of wafers become absolutely essential.
During wafer handling, wafer-handling robots are critical equipment for ensuring production efficiency and quality. Autonomous controllability and domestic substitution of wafer-handling robots have become mainstream trends. Xinsida Robotics ranks among the industry’s top tier, driven by a strong sense of national responsibility and a commitment to domestic manufacturing. Leveraging its deep expertise in industrial robotics and motion control, Xinsida has successfully developed a variety of semiconductor robots.
Customer needs
Fast dynamic response, high stability, and high precision.
Xinshida Solution
Proposal Description
The FA-series wafer robots, with their high precision, high speed, high reliability, and ability to support rectangular equipment layouts without requiring traversing axes, have become a key choice in the semiconductor industry. They can be widely used in intelligent logistics systems for wafer fabs and advanced packaging applications.
Smart Logistics System for Wafer Fab
• Automated transfer of wafer cassettes (FOUPs): Supports precise gripping and rapid transport of SEMI-standard 300mm wafer cassettes.
• Process equipment docking: (Applicable to handling equipment in the semiconductor industry (wafer loading and unloading), optoelectronics industry (small panels, small solar panels), LED industry (sapphire substrates, adhesive rings), etc.)
• Cleanroom Environment Adaptation: Continuous and stable operation in a Class 1 cleanroom environment
Advanced Packaging Applications
• 3D IC Stacking: Chip Pick-and-Place with μm-Level Precision
• Flip-chip bonding process: Achieves alignment accuracy of ±5 μm when paired with a vision system.
• Wafer-level packaging: Supports non-destructive handling of ultra-thin wafers (50μm).
Scheme advantages
The FA-series wafer robots feature four-axis coordinated precision control, employing an innovative four-axis joint design (J1–J4 axes). By combining linear motion along the Z-axis with composite motion along the X/Y axes, these robots achieve highly accurate positioning of wafers in three-dimensional space. Specifically, the J2/J3 axes work in coordinated control to manage the motion trajectory in the horizontal plane, while the J4 axis independently handles the orientation adjustment of the end effector, thereby meeting the stringent requirements for angular compensation during wafer transfer.
Faster dynamic response capability
Equipped with the SC410 integrated drive and control platform, this system innovatively integrates motion control, servo drives, and I/O communication modules. It adopts a multi-core heterogeneous processor architecture, achieving a real-time control cycle of 1 ms and significantly enhancing the dynamic response performance of multi-axis coordinated motion.
Higher stability
The truss-type fuselage structure, optimized through finite element analysis and paired with aerospace-grade aluminum alloy materials, achieves a 40% increase in structural stiffness while reducing the overall weight by 25%. The triple-damping design effectively suppresses high-frequency vibrations, ensuring positioning stability under an acceleration of 10 m/s².
Improved athletic performance
• Linear speed: 2.5 m/s
• Repeatability: ±0.05 mm (ISO 9283 standard)
• Acceleration: 15 m/s²
• MTBF: 50,000 hours
A smarter control system
• Built-in collision detection and torque compensation algorithm
• Programmable Path Planning Software (ARStudio)
Quick-change joint
• Modular joint design: Single joint replacement time < 30 minutes
Higher market competitiveness
• 4-hour rapid response mechanism
• Regional Spare Parts Centers (North China / East China / South China)
• Customized process package development services
• SEMI S2/S8 safety certification support
Schematic diagram of the working range of the Xindashida FA-series wafer robot.
Scheme Composition
Schematic Diagram of the FA Series Wafer Robot System
Associated products
FA4230_4-Axis Atmospheric Horizontal Multi-Joint Single-Arm Wafer Handling Robot
Project Results
The FA-series wafer robots have been deployed in large quantities at a certain 12-inch wafer fabrication plant (with a monthly production capacity of 50,000 wafers) and have undergone validation on the current third-generation semiconductor production line (GaN/SiC). Thanks to their four-axis collaborative control algorithm, intelligent drive system, and modular architectural design, the FA-series wafer robots have achieved internationally leading performance in key metrics such as motion accuracy (±0.05 mm) and operating speed (2.5 m/s). Leveraging New Shida Robot’s unique localized service system and cost advantages, the FA-series wafer robots have become the preferred solution for upgrading domestic semiconductor equipment, helping to propel semiconductor manufacturing toward higher levels of automation.
Real-world footage of FA-series wafer robots: Since 2020, based on market customization needs and equipment safety requirements, Xinsida Robotics has developed a series of atmospheric and vacuum-compatible robotic arms capable of handling wafers ranging in size from 2 inches to 12 inches. These robots have now been successfully deployed in various semiconductor equipment processes—including EFEM, stocker systems, furnace tubes, wet-process equipment, photoresist coating and development, and thin-film deposition—enabling applications such as pick-and-place operations, loading and unloading, and inspection tasks. Leveraging its powerful control system capabilities, Xinsida Zhongweixing has achieved an exceptional balance of multiple performance attributes—speed, precision, and stability—ensuring the consistent reliability and stability of wafer handling.
After years of technological accumulation, Xindada ADTECH® wafer robots have achieved domestic substitution in terms of product performance. Leveraging the localized market expertise and established presence of our original industrial robots, we can offer customers services that provide even greater advantages in terms of return on investment and service response speed.
