Xinshida Zhongweixing’s atmospheric dual-arm five-axis wafer robot in wafer handling applications.
2025-07-10
Xinshida Zhongweixing’s atmospheric dual-arm five-axis wafer robot in wafer handling applications.
Project Background
In both the front-end and back-end processes of semiconductor manufacturing, wafer robots play a crucial role.
In the front-end process, high-precision transmission in an ultra-clean environment is required. High-precision positioning Anti-vibration and particle contamination resistance, suitable for lithography, etching, and other equipment; in the back-end process, it performs dicing and packaging handling, requiring high speed, stability, and temperature resistance. Chemical corrosion It is compatible with wafers of multiple sizes, ensuring damage-free chip transfer and precise alignment.
All of this calls for wafer robots to feature intelligent scheduling and a low failure rate, while simultaneously boosting both efficiency and yield.
Customer needs
In the semiconductor industry, as process complexity increases, traditional single-Z-axis robots are facing an efficiency bottleneck. On the one hand, during the handling of stacked wafers, the stroke length of a single-Z-axis robot is often insufficient, making it difficult to meet the requirements for transporting multi-layer stacked wafers. On the other hand, when transferring materials between process chambers at different heights, the movement limitations of single-Z-axis robots lead to increased waiting times, thereby wasting valuable production capacity. These issues highlight the limitations of conventional single-Z-axis robots in modern semiconductor manufacturing, underscoring the urgent need for new solutions to enhance production efficiency.
Xinshida Solution
Scheme Description
The Xindashida Atmospheric Dual-Arm Five-Axis Wafer Robot is a high-performance wafer-handling device specifically designed for front-end and back-end semiconductor processes. It is suitable for Class 1–5 cleanroom environments and serves as an essential wafer-handling tool for critical manufacturing processes such as photolithography, thin-film deposition, and inspection. With exceptional positioning accuracy (±0.1 mm), ultra-low particle contamination (<0.1 μm particles ≤ 1 particle/ft³), and outstanding reliability, this robot provides an effective solution for advanced wafer fabrication.
Scheme advantages
The Xindashida atmospheric dual-arm five-axis wafer robot features a dual-Z-axis design, breaking through spatial constraints with vertical parallelization!
Larger vertical stroke
Single-Z-axis wafer handlers typically support a lifting stroke ranging from 200 mm to 500 mm. The dual-Z-axis configuration, featuring a layered telescopic design, enables a longer vertical stroke without increasing the overall height of the handler itself, thereby meeting the SEMI standard requirement of a 900 mm wafer-handling position and accommodating the pick-and-place needs of multi-layer wafer cassettes or complex process equipment.
Compact spatial structure
The dual Z-axis adopts an off-plane rail layout and a modular design, which not only enhances mechanical rigidity but also reduces the overall size. This design is particularly well-suited for compact semiconductor equipment platforms, helping to avoid occupying limited space due to bulky structures and improving the flexibility of equipment layout.
Higher operational efficiency
The dual-Z-axis design supports multi-axis coordinated control, enabling simultaneous handling of pick-and-place tasks at different heights. This reduces motion-switching time and achieves coordinated movement between lifting and rotating, significantly shortening the wafer transfer cycle and boosting production line throughput.
Precise and reliable
High-rigidity robotic arm design: The lifting, rotating, and telescoping axes all achieve a repeatable positioning accuracy of ±0.1 mm.
Efficient and convenient
Two-axis interpolation enables the picking and placing of two parallel-mounted cassettes. For multi-layer picking and placing at equally spaced positions, only one teach-in is required. A single composite motion command can complete the entire picking and placing operation, requiring just one teach-in point. The independent Z-axis drives for the upper and lower sections allow simultaneous execution of the “pick + place” action, significantly reducing cycle time.
Custom-compatible
Compatible with wafer specifications ranging from 100 to 300 Φ; supports mapping functionality; supports customization of end-effector features such as flip devices and fingertip ends; supports customization of different arm spans and stroke lengths.
Associated products
TBA4894D_5-Axis Atmospheric Cylindrical Coordinate Dual-Arm Wafer Handling Robot
TBA4030F-07-09_4-Axis Atmospheric Cylindrical Coordinate Dual-Arm Wafer Handling Robot
Project Results
This solution is widely used in the front-end processes of semiconductor manufacturing (wafer handling in photoresist coating, ion implantation, and CVD/PVD equipment) as well as in inspection and metrology processes (wafer handling in photoresist coating, ion implantation, and CVD/PVD equipment).
