The application of Xindashida motion control systems in LED taping machines in the 3C electronics industry.
2025-07-16
Project Background
In the field of electronic component manufacturing, LED taping machines—being the core equipment in the packaging stage—directly determine product yield and production efficiency through their performance. However, traditional taping machines have long been plagued by two major challenges: it has been difficult to break through the bottleneck in yield rates, and production efficiency has struggled to keep pace with the ever-growing market demand. To overcome these challenges, Xinsida has developed a new-generation, fully automatic LED taping machine.
Customer needs
Yield bottleneck:
Manual or semi-automatic taping machines often struggle to achieve high-precision positioning standards below ±0.05 mm, which leads to significant deviations in the orientation of component leads after taping. As a result, product yields typically fall below 95%, severely impacting both product quality and production efficiency.
Low production efficiency:
The height adjustment of the camera on traditional tape-and-reel machines relies heavily on manual operation. Each time the product type is changed, extensive time is required for debugging, making it difficult to exceed a UPH (units per hour) of 1,200 and thus failing to meet current market demands for miniaturization and multi-batch production.
Xinshida Solution
Scheme advantages
1. Flying-shot technology: Dynamic capture with zero-delay correction
Traditional visual inspection requires pausing the equipment before capturing images, whereas Xindashida’s fly-capture technology uses dynamic high-speed imaging combined with AI algorithms to capture real-time positional information even as materials move at high speeds.
• Ultra-high-precision positioning with an accuracy of ±0.025 mm, reducing errors by 50% compared to conventional equipment;
• Millisecond-level angular correction ensures consistent LED pin orientation, boosting yield to 99.8%;
• Seamlessly adapts to multi-part production; by pre-setting parameters via the ADT Automation Studio platform, the time required to switch between part numbers is reduced to within 30 seconds.
• Simultaneous high-speed capture of four sets: Four sets of materials are captured and positioned simultaneously at high speed, combined with multi-axis coordinated control to achieve rapid correction four times faster, boosting efficiency by a factor of four.

Fully automatic LED taping machine equipped with the Xinshida motion control solution
2. Multi-axis coordination: A win-win for efficiency and stability
The ADT-8909 motion control card and the Sintronic Ω6 servo system innovatively create an intelligent correction solution. By leveraging high-speed fly-scan technology, they achieve real-time offset detection and employ multi-axis synchronization to perform real-time position correction during material conveyance.
Thanks to the support of fly-capture and multi-axis coordination technologies, users’ units per hour (UPH) can be significantly increased from 1,200 pieces to 1,600 pieces—a 30% improvement over the industry average.

Fully automatic LED taping machine equipped with the Xinshida motion control solution
Scheme Composition
In the core configuration of the new-generation fully automatic LED taping machine, the motion control system employs the advanced ADT-8909 series motion control card, while the servo system utilizes the Sintronic Ω6 series. This combination ensures that the equipment maintains stability and precision even at high speeds.

Associated products
ADT-8989 C1/H1 High-performance eight-axis pulse motion control card based on the PCI bus
ADT-89C9 C1/H1 High-performance 12-axis pulse motion control card based on the PCI bus
Singlina Ω6-A Servo Drive
Project Results
Xinshida’s visual flying-camera technology has successfully broken through the bottlenecks of traditional techniques, achieving a deep integration of high-precision positioning and efficient production. Looking ahead, Xinshida will continue to focus on technological innovation, driving more industries toward a new era of intelligent and high-precision manufacturing, and providing strong impetus and support for the upgrading and development of electronic component manufacturing.